Kuneziningana izinhlobo zesokhethi izinhlobo zebhodi lomama okufanele uzazi. Njengamanje, ezinye zisetshenziswa, njenge-LGA, BGA, ne-PGA, kodwa zikhona ezinye izinhlobo. Kulesi sihloko, uzofunda ngazo zonke, kanye nezinzuzo zazo kanye nokubi.
I-SIP
Un Isokhethi ye-SIP (Iphakheji Elilodwa Emgqeni) Kuwuhlobo lwesokhethi noma isixhumi esisetshenziselwa ukukhweza nokuxhuma amasekethe ahlanganisiwe (ama-IC) kumishini kagesi. Igama elithi "single-in-line" lisho ukuhlelwa kwezikhonkwane ze-IC emugqeni owodwa, ngokuphambene namaphakheji anemigqa emibili efana ne-DIP (Iphakheji Eliphakathi Komugqa Elibili).
Isokhethi ye-SIP isetshenziswa ikakhulukazi ezinhlelweni lapho amasekethe ahlanganisiwe adinga khona ishintshwe noma ibuyekezwe njalo. Inikeza isixhumi esibonakalayo somshini kanye nogesi phakathi kwe-IC kanye nebhodi lesifunda eliphrintiwe (PCB), okuvumela i-IC ukuthi ifakwe kalula futhi ikhishwe kusokhethi ngaphandle kokunamathisela.
Isokhethi ye-SIP iqukethe a igobolondo lepulasitiki egcina ukuxhumana kwensimbi ngaphakathi. Laba othintana nabo baqondana nezikhonkwane ze-IC futhi banikeze uxhumano lukagesi oluthembekile phakathi kwe-IC ne-PCB. Amasokhethi e-SIP adizayinelwe osayizi abahlukahlukene kanye nokucushwa kwamaphini, okuwavumela ukuthi amukele izinhlobo ezahlukene zama-IC.
Okusemqoka Inzuzo yamasokhethi e-SIP yikhono lokushintsha noma uthuthukise ama-IC ngokushesha futhi kalula ngaphandle kwesidingo sokunamathisela. Lokhu kuwusizo ezinhlelweni zokusebenza ezifana ne-prototyping, ukuhlola isifunda, ukuthuthukiswa komkhiqizo, nokulungisa, lapho ama-IC adinga ukushintshwa njalo. Ngaphezu kwalokho, amasokhethi e-SIP nawo ahlinzeka ngokuvikeleka ku-IC naku-PCB ngokuvimbela ukulimala kokushisa phakathi nenqubo yokuhlanganisa.
Awekho ama-CPU aphawulekayo analolu hlobo lwesokhethi...
I-ZIP
Kulokhu ifana ne-SIP noma i-DIP, kuphela esikhundleni sokuba nomugqa owodwa wamaphini njenge-SIP, inamabili afana ne-DIP. Kodwa-ke, ngokungafani ne-DIP, izikhonkwane aziqondaniswanga nhlangothi zombili ze-chip, kodwa zisesimweni i-zig Zag emgqeni. Ngakho igama layo I-Zig-zag In-Line Package.
I-DIP
Un Isokhethi ye-DIP (Iphakeji Elikumugqa Elikabili) Kuwuhlobo lwesokhethi noma isixhumi esisetshenziselwa ukukhweza nokuxhuma amasekethe ahlanganisiwe (ama-IC) kumishini kagesi. Igama elithi "okukabili emgqeni" libhekisela ekuhlelweni kwamaphini e-IC emigqeni emibili ehambisanayo.
Isokhethi ye-DIP isetshenziswa kakhulu ezinhlelweni lapho amasekethe ahlanganisiwe ehloselwe ukuthi afakwe unomphela ebhodini lesekethe eliphrintiwe (PCB). Iqukethe a izindlu zepulasitiki noma ze-ceramic egcina uchungechunge lwezokuxhumana zensimbi. Laba othintana nabo baqondana nezikhonkwane ze-IC futhi banikeze uxhumano lukagesi oluzinzile noluthembekile phakathi kwe-IC ne-PCB.
El inqubo yokuhlanganisa Ukufaka i-IC kusokhethi ye-DIP kuhlanganisa ukufaka izikhonkwane ze-IC koxhumana nabo abahambisanayo kusokhethi. Izikhonkwane noxhumana nabo bakhelwe ukuthi balingane kahle futhi bakhe uxhumano oluvikelekile. Uma isifakiwe, i-IC ibanjelwa ngokuqinile endaweni futhi ingadlulisela amasignali kagesi phakathi kwe-IC ne-PCB.
Kuwo wonke umlando kube nama-chips amaningi alolu hlobo lwesokhethi, njenge-MOS Technology 6502, i-Motorola 6800 ne-68K, ama-Intel chips ngaphambi kuka-80186, njll.
I-PLCC
El Isokhethi le-PLCC (Isithwali se-Plastic Leaded Chip) Kuwuhlobo lwesokhethi noma isixhumi esisetshenziselwa ukukhweza nokuxhuma i-PLCC-type integrated circuits (ICs) kumishini kagesi. Igama elithi "plastic leaded" lisho isikhwama sepulasitiki esihlala i-IC, futhi "isithwali se-chip" sisho uhlobo lokupakishwa kwe-IC.
Ama-PLCC IC amasekhethi ahlanganisiwe anamaphini noma amatheminali kuzo zonke izinhlangothi ezine kusuka kuphakheji, futhi lezi zikhonkwane zinwebeka ngaphandle ngephethini yesikwele noma engunxande. Isokhethi ye-PLCC yakhelwe ngokukhethekile ukuthi ihlale futhi ixhume lawa ma-PLCC IC.
Isokhethi ye-PLCC iqukethe isisekelo sepulasitiki esinochungechunge lwe oxhumana nabo bensimbiLaba othintana nabo batholakala ngaphakathi kwesokhethi futhi baklanyelwe ukuthintana nezikhonkwane ze-PLCC IC lapho zifakwa kusokhethi. Bahlinzeka ngoxhumano lukagesi oluvikelekile noluthembekile phakathi kwe-IC kanye nebhodi lesekethe eliphrintiwe (PCB).
El inqubo yokuhlanganisa Ukufaka i-PLCC IC esokhethini ye-PLCC kuhilela ukuqondanisa izikhonkwane ze-IC noxhumana nabo abahambisanayo kusokhethi bese ucindezela i-IC phansi kuze kube yilapho izikhonkwane zithintana nezisokhethi. Lokhu kuqinisekisa ukuxhumana okufanele nokuzinzile phakathi kwe-IC ne-PCB.
Kube nezibonelo eziningi zalolu hlobo lwama-CPU, njenge-Intel 80186, 80286, 80386, amamodeli ahambisana ne-AMD, nezinye eziningi.
I-PGA
Un PGA (Pin Grid Array) isokhethi Kuwuhlobo lwesokhethi noma isixhumi esisetshenziselwa ukukhweza nokuxhuma amasekethe ahlanganisiwe (ama-IC) kumishini kagesi. Igama elithi "pin grid array" libhekisela ekuhlelweni kwamaphini e-IC ku-matrix noma igridi.
Kwisokhethi ye-PGA, i Izikhonkwane ze-IC zitholakala ngezansi futhi inwebe ngaphandle ngendlela yohlelo olunezinhlangothi ezimbili. Isokhethi ye-PGA inesakhiwo sokuxhumana esifana nokucushwa kwephinikhodi ye-IC, okuvumela ukuxhumana okunembayo nokuvikelekile.
Inqubo yokukhweza i-IC kusokhethi ye-PGA ibandakanya qondanisa izikhonkwane ye-IC noxhumana nabo abahambisanayo kusokhethi bese ucindezela ngobumnene i-IC phansi ukuze izikhonkwane zixhumane nezixhumi zesokhethi. Oxhumana nabo kusokhethi ye-PGA baklanyelwe ukuhlinzeka ngoxhumano lukagesi oluqinile noluthembekile phakathi kwe-IC nebhodi lesekethe eliphrintiwe (PCB).
Kusukela ku-Intel 80386 kuze kube muva nje, amasokhethi amaningi e-CPU abengalolu hlobo ku-x86. Kodwa futhi ngaphandle kwalo mndeni, njengalezo eziku-DEC Alpha, IBM PowerPC, Intel Itanium ezinguqulweni zayo zokuqala, i-HP PA-RISC, njll.
I-PGA ZIF
Akuyona isokhethi ngese ngayinye, kodwa kunalokho ukuthuthuka kunangaphambili. Ngenkathi ama-PGA okuqala kufanele afakwe ngokucindezela i-chip lapho izimbobo zifana nezikhonkwane, I-ZIF (Zero Insertion Force) Awudingi ukuphoqa lutho, yingakho igama. Ukuze wenze lokhu, bane-lever ohlangothini, njengoba kubonakala esithombeni esingenhla. Kufanele nje uyiphakamise nge-engeli engu-90° kusokhethi ukuze ukhulule izikhonkwane zokufaka noma zokukhipha i-chip. Uma lokhu sekwenziwe, uyayehlisa, uvikele izikhonkwane.
BGA
Akuyona isokhethi ngese, kodwa kuhle ukwazi ngakho, njengoba iyisokhethi esetshenziswa kakhulu kuma-laptop processors. I-BGA (I-Ball Grid Array) Kuwuhlobo lokupakisha olusetshenziswa kumasekethe ahlanganisiwe (ICs) kumishini kagesi. Ku-BGA, ukuxhunywa kukagesi kwenziwa ngamabhola amancane e-solder ahlelwe ngephethini yegridi phansi kwe-IC. Lawa mabhola e-solder athintana ngqo noxhumana nabo ebhodini lesifunda eliphrintiwe (PCB), okuvumela ukuxhumana okuthembekile kukagesi. Ukupakishwa kwe-BGA kusetshenziswa kakhulu ezinhlelweni ezidinga ukuminyana kwephinikhodi nokukhipha ukushisa okuthuthukisiwe, okufana namaphrosesa, ama-memory chips, namadivayisi anamandla amakhulu. Inikeza izinzuzo mayelana nokusebenza, ukwethembeka, nokusebenza kahle kokushisa, nakuba ukufakwa nokulungiswa kwayo kungase kube yinkimbinkimbi ngenxa yesidingo sokuthengisa amabhola e-solder.
I-LGA
El LGA (Land Grid Array) isokhethi Kuwuhlobo lwesokhethi noma isixhumi esisetshenziselwa ukukhweza nokuxhuma amaphrosesa kumabhodi omama. Ngokungafani namasokhethi e-PGA (Pin Grid Array), lapho izikhonkwane zikuphrosesa, kusokhethi le-LGA izikhonkwane zitholakala ebhodini lomama. Iprosesa, ngakolunye uhlangothi, inochungechunge lwamaphedi okuxhumana ahambisana nezikhonkwane kusokhethi ye-LGA. Ngesikhathi sokufakwa, iphrosesa ifakwa kusokhethi ye-LGA futhi icindezelwe phansi ukuze amaphedi axhumane nezikhonkwane zesokhethi, ngaleyo ndlela kusungulwe uxhumano lukagesi.
Futhi, inikeza izinzuzo njengokusatshalaliswa kokushisa okungcono kanye nokuminyana kwamaphinikhodi, okuvumela amandla amakhulu okucubungula nokusebenza okuthuthukisiwe kumasistimu ekhompyutha.
Amaphrosesa esimanje kakhulu futhi athuthuke kakhulu avela ku-Intel, AMD, nabanye sebevele basebenzisa i-LGA, njengoba ivumela ukuminyana kwamaphini. Izibonelo zifaka i-AMD Ryzen 7000 Series, isizukulwane sakamuva se-Intel processors, i-Xeon, ne-AMD EPYC, i-Threadripper, nezinye.
slot
Nakuba ayengavamile, kwakukhona nezibonelo zama-CPU afakwe kuwo izikhala (I-Single Edge Contact Cartridge) esikhundleni samasokhethi, njengoba kwenzeka nge-Intel Pentium II, i-Pentium III, ne-Celeron ne-Slot 1 yabo, i-AMD Athlon (K7) ne-Slot A yabo, i-Intel Pentium II Xeon ne-Pentium III Xeon ne-Slot 2 yabo, njll.
para Ukufaka iphrosesa lapha kwenziwe njenganoma yiliphi elinye ikhadi lokunweba. noma i-RAM ku-slot yayo. Yayicindezelwa phakathi, ifanise inothi ku-CPU ne-slot, futhi izakhiwo eziseceleni zibambe iyunithi endaweni. Ukuze uyisuse, vula amathebhu aseceleni futhi uyidonsele kude ne-CPU...
I-Slotet
I-Los slotkets Zingama-adaptha avumela ukusetshenziswa kwama-microprocessors asekelwe esokhethi kuma-motherboards asekelwe slot.
Zadalwa ekuqaleni ukuze zivumele ukusetshenziswa kwe-Socket 8 Pentium Pro processors kumabhodi omama we-Slot 1. Kamuva, baduma kakhulu ngokufaka i-Socket 370 Intel Celerons kumabhodi omama asekelwe ku-Slot 1. Lokhu kwehlisa izindleko zabakhi bamakhompyutha, ikakhulukazi emishinini eyi-dual-processor. Amabhodi omama asezingeni eliphakeme amukele amaphrosesa amabili e-Slot 1 (imvamisa i-Pentium 2) ayetholakala kabanzi, kodwa amabhodi omama anesokhethi akabili we-Socket 370 Celerons ebiza kancane abengekho. Ama-Slotkets ahlala edumile phakathi noshintsho ukusuka ku-Slot kuya ku-Socket 1-based Pentium III processors, okuvumela ukuthuthukiswa kwe-CPU kumabhodi omama asekelwe ku-Slot XNUMX akhona.
Abakaze bethulwe ukusizakala ngoshintsho lwe-AMD Athlon processors ukusuka ku-Slot A form factor kuya ku-Socket A form factor. Namuhla, ama-slotkets anyamalele ikakhulukazi ngoba i-Intel ne-AMD abakaze bakhiqize ama-PCU ezicini zefomu le-slot kusukela ngo-1999.